Caractéristiques de conception
- High Thermal Conductivity – Up to 170–200 W/m·K for efficient heat transfer.
- Excellente isolation électrique – Suitable for high-voltage and high-frequency applications.
- Low Dielectric Constant & Loss – Stable performance in RF and microwave environments.
- High Mechanical Strength – Wear-resistant and capable of withstanding mechanical stress.
- Stabilité chimique – Resistant to oxidation, acids, and alkalis.
- Custom Machining Available – Precision cutting, drilling, and polishing to client specifications.
Domaines d’application
- Semiconductor Devices – Substrates and housings for IGBT, MOSFET, and power modules.
- LED Lighting Systems – Heat dissipation bases and mounting plates for high-power LEDs.
- Power Electronics – Thermal management components for converters, inverters, and rectifiers.
- Microwave & RF Communication – Components for radar, satellite, and telecom equipment.
- Aerospace & Defense – Electronic packaging and thermal management in avionics systems.
- Automotive Electronics – Electric vehicle power control units and battery cooling parts.