Características de diseño
- Alta conductividad térmica – Hasta 170–200 W/m·K para una transferencia de calor eficiente.
- Excelente aislamiento eléctrico – Suitable for high-voltage and high-frequency applications.
- Baja constante dieléctrica y pérdida – Stable performance in RF and microwave environments.
- Alta resistencia mecánica – Wear-resistant and capable of withstanding mechanical stress.
- Estabilidad química – Resistant to oxidation, acids, and alkalis.
- Mecanizado personalizado disponible – Precision cutting, drilling, and polishing to client specifications.
Áreas de aplicación
- Dispositivos semiconductores – Substrates and housings for IGBT, MOSFET, and power modules.
- Sistemas de iluminación LED – Heat dissipation bases and mounting plates for high-power LEDs.
- Electrónica de potencia – Thermal management components for converters, inverters, and rectifiers.
- Microwave & RF Communication – Components for radar, satellite, and telecom equipment.
- Aerospace & Defense – Electronic packaging and thermal management in avionics systems.
- Electrónica automotriz – Electric vehicle power control units and battery cooling parts.