Aluminum Nitride Ceramic Heat Sink

Caractéristiques de conception

• High Thermal Conductivity – Up to 170–200 W/m·K for efficient heat transfer.
• Excellente isolation électrique – Prevents electrical leakage while managing heat.
• High Mechanical Strength – Resistant to mechanical stress and wear.
• Low Dielectric Constant & Loss – Suitable for high-frequency electronic applications.
• Stabilité chimique – Resistant to oxidation and most chemicals.
• Custom Machining Available – Precision cutting, drilling, and polishing per client requirements.

Domaines d’application
Semiconductor Devices
Thermal management for power modules, IGBT, MOSFET.

LED Lighting
Heat sinks and substrates for high-power LED modules.

Power Electronics
Cooling components for converters, inverters, and rectifiers.

Telecommunication Equipment
Base stations, microwave communication devices.

Aerospace & Military
Thermal solutions for radar, avionics, and defense electronics.

Automotive Electronics
Electric vehicle power systems and battery thermal control.