Designmerkmale
Anwendungsbereiche
Halbleiterbauelemente
Thermal management for power modules, IGBT, MOSFET.
LED Lighting
Heat sinks and substrates for high-power LED modules.
Leistungselektronik
Cooling components for converters, inverters, and rectifiers.
Telecommunication Equipment
Base stations, microwave communication devices.
Aerospace & Military
Thermal solutions for radar, avionics, and defense electronics.
Automotive-Elektronik
Electric vehicle power systems and battery thermal control.
Shenzhen Hard Precision Ceramic Co., Ltd.